http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103219062-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3613 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D5-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00 |
| filingDate | 2013-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103219062-B |
| titleOfInvention | Polymer Thick Film Solder Alloy Conductor Composition |
| abstract | The present invention relates to a polymer thick film composition comprising: solder alloy powder and an organic medium comprising an organic polymer binder and a solvent. The composition can be processed for the time and temperature necessary to remove all solvent. The invention also relates to one or more methods of using such compositions to form electrodes on electrical circuits, and to articles formed from such methods and/or compositions. |
| priorityDate | 2012-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 42.