http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103202107-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-124 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-282 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate | 2011-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103202107-B |
| titleOfInvention | The manufacture method of printed wiring board and printed wiring board |
| abstract | The object of this invention is to provide the manufacture method of the printed wiring board of the insulating reliability excellence of wiring closet.The manufacture method of printed wiring board of the present invention comprises: layer forming step, the copper making there is substrate and be configured on substrate or the core substrate of copper alloy distribution, with comprise 1,2,3-triazoles and/or 1,2,4-triazole and the treatment fluid contact of pH value display 5 ~ 12, then by solvent clean core substrate, and formed on the surface in copper or copper alloy distribution and comprise 1,2, the copper ion diffusion inhibiting layer of 3-triazole and/or 1,2,4-triazole; And dielectric film forming step, after layer forming step, on the core substrate being provided with copper ion diffusion inhibiting layer, form dielectric film. |
| priorityDate | 2010-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.