http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103194163-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c04725b9ff3a7718d33d38e603d10e5a |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G65-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-56 |
| filingDate | 2013-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d0fb6d6d7b2a4c7a99147a547831742f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4c750b53d2bae13602d725dce5ccad8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c18ca8d434e4b0db80b453b2ec785525 |
| publicationDate | 2014-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103194163-B |
| titleOfInvention | Preparation method of moderate-temperature solidified and high-temperature resistant conductive adhesive |
| abstract | The invention provides a preparation method of a moderate-temperature solidified and high-temperature resistant conductive adhesive. The preparation method comprises the steps that bismaleimide as a raw material is dissolved in a dimethyl formamide or dimethyl sulfoxide solvent; polyether amine is added; michael addition occurs; chain extension of bismaleimide occurs; mono functional group added organic acid and secondary amine on bismaleimide after the chain extension dehydrate to amidate; tough bismaleimide is synthesized, and mixed with epoxy resin; an epoxy diluent, micron-sized metal powder, and a coupling agent are added to a mixture sequentially; a curing agent is added to the mixture, and mixed uniformly; and the conductive adhesive is prepared. The preparation method has the advantages that bismaleimide is modified, the high strength and the heat resistance of bismaleimide can be maintained, and bismaleimide has the toughness of polyether amine. In addition, reactive hydrogen on secondary amine reacts with organic acid, so that the conductive adhesive has better stability, and the tough bismaleimide is mixed with the epoxy resin, so that the usable life is longer. |
| priorityDate | 2013-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 113.