http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103180116-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29L2031-3076 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29L2031-3085 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C2043-3649 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02T50-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C35-02 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29D99-0014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C70-446 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C43-3642 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C71-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C35-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C35-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C71-02 |
| filingDate | 2011-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103180116-B |
| titleOfInvention | For making composite component bond altogether with rigidity/extending shape-memory polymer equipment or the method and system of co-curing |
| abstract | For the manufacture of a method and apparatus for the composite component of such as fuselage or inner reinforcing elements, wherein shape-memory polymer (SMP) equipment can be used as rigidity laminating tool and utricule.This SMP equipment can be heated until extending, shaping, is then cooled to the rigid tool structure of expectation.Such as, cavity can be formed in SMP equipment, in order to make parts setting-in enter in it, to bond altogether or co-curing with composite component.Next, composite can be put on SMP equipment, then be positioned in rigid outer instrument, and be heated to composite material solidification temperature, at such a temperature, SMP equipment is extending.Can cause pressure reduction, this pressure reduction promotes SMP equipment so that composite is compressed rigid outer instrument.When composite material solidification, SMP equipment can be pushed away the composite of solidification and remove in composite component. |
| priorityDate | 2010-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.