| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1476
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1492
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0789 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-424
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-04 |
| filingDate |
2011-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2019-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-103179806-B |
| titleOfInvention |
Combined Through-Hole Plating and Hole Filling Method |
| abstract |
The present invention relates to a method of electroplating copper in the manufacture of printed wiring boards, IC substrates, and the like. The method is suitable for combined conformal via filling and blind microvia filling. The method utilizes a metal redox system and pulsed reverse plating. |
| priorityDate |
2011-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |