http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103177974-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48472 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 |
| filingDate | 2011-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2014-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103177974-B |
| titleOfInvention | Process for manufacturing discrete electronic component of copper sheet electrode |
| abstract | The invention relates to a process for manufacturing a discrete electronic component of a copper sheet electrode. A plurality of chips are respectively arranged on a plurality of chip bearing seats of a wire support and electrically connected with the chip bearing seats via guide connection layers, a plurality of welding lines are respectively electrically connected with a plurality of pins and the chips of the wire support, the wire support is arranged on a mould-sealed mould group, the chips, the welding lines and a plurality of longitudinal connecting ribs between the chip bearing seats and the pins are sealed via packaging colloid, then, the mould-sealed mould group is removed, the wire support is arranged on a press-fit mould group, the longitudinal connecting ribs of the wire support are removed via a high-rotating-speed cutter by the aid of a lower cutting channel and an upper cutting channel of the press-fit mould group, and then a plurality of the discrete electronic components are formed. The technical scheme solves the technical problem that the pins are deformed or broken caused by the condition of bad cabriole legs in the prior process for manufacturing the electronic component, thereby influencing the manufacture process yield, and simplifying the manufacture process. |
| priorityDate | 2011-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 19.