http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103155098-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76805 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06565 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06544 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06513 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5223 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N97-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L28-91 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 |
| filingDate | 2011-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103155098-B |
| titleOfInvention | 3D Via Capacitors with Floating Conductive Plates for Improved Reliability |
| abstract | The invention provides a 3D via hole capacitor and a forming method thereof. The capacitor includes an insulating layer on a substrate. The insulating layer has a via with sidewalls and a bottom. The first electrode overlies at least a portion of the bottom and sidewalls of the via hole. A first high-k dielectric material layer is stacked over the first electrode. The first conductive plate is located on the first high-k dielectric material layer. A second layer of high-k dielectric material overlies the first conductive plate and leaves the remainder of the via unfilled. A second electrode is formed in the remaining portion of the via hole. The first conductive plate is substantially parallel to the first electrode and is not in contact with the first electrode and the second electrode. Arrays of such 3D via capacitors are also provided. |
| priorityDate | 2010-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 24.