| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F230-085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F20-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2312-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-1811
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2312-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1639
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-1802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-1025 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1233
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L51-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-291
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F8-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F285-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J151-003 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-00 |
| filingDate |
2011-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2016-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-103119701-B |
| titleOfInvention |
Liquid resin composition and semiconductor device |
| abstract |
According to the present invention, even if the semiconductor packages that also demonstrates the liquid resin composition of the excellent cracking of resistance to scolder in the high-temperature solder reflow treatment of the good and 260 DEG C of left and right using as lead-free solder of wetting autgmentability after chip is installed and use this liquid resin composition is provided. Liquid resin composition of the present invention is characterised in that, the carbon number that has that the acrylic copolymer with free-radical polymerised functional group contains 10 % by weight～40 % by weight in entire infrastructure monomer is that (methyl) alkyl acrylate of 6～9 straight or branched alkyl is as structure monomer. |
| priorityDate |
2010-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |