http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103102689-B

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09C1-40
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filingDate 2011-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2015-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_05bbe3182a1a0e864472ecbf78caf639
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_77f895cb29788e6e2e286b0639d4235a
publicationDate 2015-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-103102689-B
titleOfInvention A kind of high thermal conductivity silicone potting compound and its application
abstract The invention provides a high thermal conductivity organic silica gel potting compound and its application, which includes A component and B component, wherein, A component includes: 100 parts of vinyl silicone oil; 6 to 14 parts of hydrogen-containing silicone oil; 400-1000 parts of silicon-coated alumina powder; 0.1-0.8 parts of inhibitor; B component includes: 100 parts of vinyl silicone oil; 400-1000 parts of silicone-coated alumina powder; 0.2-1.5 parts of catalyst . Under the premise of ensuring low viscosity of the silicone encapsulant, the composition of the invention can still achieve a high amount of aluminum oxide added and improve the thermal conductivity of the encapsulant.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/RU-2727401-C1
priorityDate 2011-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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