http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103087423-B
Outgoing Links
Predicate | Object |
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classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F210-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F4-646 |
filingDate | 2011-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2015-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2015-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-103087423-B |
titleOfInvention | A kind of polymkeric substance film composition and polymeric film and multilayer film |
abstract | The invention provides a kind of polymkeric substance film composition and polymeric film and multilayer film, said composition contains propene polymer and film coalescence aid, with the total amount of described propene polymer for benchmark, the content of propylene structural unit is 80-95 % by weight, the content of ethylene unit unit is 1-10 % by weight, and the content of alpha-olefin structural unit is 1-19 % by weight; The xylene soluble content of described propene polymer is 1-20 % by weight, and dimethylbenzene insolubles content is 80-99 % by weight; The Tc of xylene soluble part is 40-65 DEG C, and melt temperature is 80-97 DEG C; The Tc of dimethylbenzene insolubles is 85-105 DEG C, and melt temperature is 125-135 DEG C.Composition good film-forming property of the present invention, the polymeric film formed by said composition has low initial heat-sealing temperature and good heat resistanceheat resistant adhesion performance.Polymeric film of the present invention is suitable for the hot sealing layer as heat-shrinkable film or multilayer film. |
priorityDate | 2011-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 135.