| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6f932d94618d9b875e401457b33e9761 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-02 |
| filingDate |
2012-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55178493c933ad4b56ac2ed8a215425d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df5dc13124f38c33b00f1247138e1e82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8a16960b5b11f1fdfb9bb80ed25c4ab1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_08041280b847aeee79c6c1ed706432d0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a4be11839ab3524f7a6155a38fa119f |
| publicationDate |
2014-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-103060805-B |
| titleOfInvention |
Method for forming metal wire harness |
| abstract |
The invention provides a method for forming a wire harness for a copper-based metal film through an etching liquid compound, so that in a double layer coating of a metallic oxide layer and a copper layer, erosion of the metallic oxide at a lower part is minimized and only the copper layer at an upper part is eroded. In addition, the etching liquid compound for the copper-based metal film is provided. |
| priorityDate |
2011-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |