http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103056560-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f41b4ae4179cf80d6b5cf4ccb2e3e76f |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 |
| filingDate | 2012-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_03d51316d9d9e24dcc48e33656c23ac9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ff2343296f1c1210a812c305ae6e1713 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f428dfa863628750cc4c4a5d02bd9e3f |
| publicationDate | 2015-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103056560-B |
| titleOfInvention | Scaling flux for soldering |
| abstract | The invention discloses a scaling flux for soldering which is made of, by weight, 81-98 parts of organic solvent, 0.2-10 parts of carboxylic acid active agent, 0.1-10 surface active agent and 0.1-2.0 organic carboxylic acid compound; the boiling point of the organic carboxylic acid compound is 100-280 DEG C, and the melting point of the organic carboxylic acid compound is 150-400 DEG C. The scaling flux for soldering has the advantages of being high in weldability, low in solid content, halogen-free, corrosion-free, high in surface insulation resistance and high in cleanliness. |
| priorityDate | 2012-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 83.