http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102990245-B
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_104f113eabf458d2adc6256a9e819635 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-30 |
filingDate | 2012-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2015-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6098ab50d8e158c9fffff0a21d5a92a2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7829a6a875b6b80ab7900062b91a9c80 |
publicationDate | 2015-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-102990245-B |
titleOfInvention | Solder wire with high content of manganese powder and preparation method thereof |
abstract | The invention discloses a solder wire with high content of manganese powder. The solder wire is characterized in that the skin is made of low carbon steel; and the core comprises the following components by weight percent: 99.90-99.95% of manganese powder, 0.01-0.02% of carbon powder, 0.005-0.01% of silicon powder, 0.02-0.04% of sulfur powder, 0.01-0.03% of phosphorus powder and 0.05-0.1% of iron powder. The solder wire has the advantages that the core adopts high content of manganese powder, so that the solder wire is hard and tough and can endure high temperature and high pressure; and the solder wire is simple in manufacturing process, easy to machine and low in cost, and the manufacturing conditions can be realized easily. |
priorityDate | 2012-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 25.