http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102977554-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1ef36ac2beab0e387cf97165a24cb05f |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 |
| filingDate | 2012-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd6020f6d4c58eb4ccdf7e837465e5c0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2ba2b360325e0226a489afbf9377e735 |
| publicationDate | 2015-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102977554-B |
| titleOfInvention | Epoxy/organosilicon co-curing composite material for LED packaging and preparation method |
| abstract | The present invention discloses an epoxy/organosilicon co-curing composite material for LED packaging and a preparation method. The epoxy/organosilicon co-curing composite material of the present invention comprises the following components by weight: 50-500 parts of epoxy hydrogen-containing cyclosiloxane, 0-10 parts of an antioxidant, 0-10 parts of an ultraviolet absorber, 0-15 parts of a light scattering agent, 100 parts of phenyl vinyl silicone resin, 0.5-15.0 parts of an epoxy curing agent, and 0.01-1.0 part of a silicon hydrogen addition curing catalyst. The present invention combines two curing ways of epoxy cationic curing and organosilicon silicon hydrogen addition curing, through the curing reaction of epoxy and silicone to prepare the epoxy/organosilicon co-curing composite material with epoxy and organosilicon interpenetrating cross-linked network structure. The epoxy/organosilicon co-curing composite material has the characteristics of an epoxy resin and an organosilicon material, and has the performances of excellent light transmittance, adhesion, mechanical strength, heat resistance and UV resistance. The preparation process of the present invention is simple, raw materials are easily available, and practicability is high. |
| priorityDate | 2012-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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