http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102977335-B

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-61
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-83
filingDate 2012-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2015-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8d10ee57a50e6cff9f8bee5cec4e5a5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32bcdc4725280ad97d7ea709fb4e72ab
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b3b7caa29ba364aa4226537823fa2c8
publicationDate 2015-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-102977335-B
titleOfInvention Method for preparing resin containing light-heat dual cured groups from epoxy chloropropane as raw material
abstract The invention discloses a method for preparing a resin containing acrylate double bonds and an epoxy cured group. The method comprises the steps of: (A) synthesizing a urethane acrylate chain segment; and (B) preparing the resin containing dual cured groups by reaction of epoxy chloropropane and the urethane acrylate chain segment. Firstly, diisocyanate reacts with dihydric alcohol, and the end is sealed by hydroxyl acrylate to prepare the urethane acrylate chain segment, and then the resin containing the dual cured groups is prepared from the epoxy chloropropane by amide reaction on the urethane acrylate chain segment under the effect of a catalyst. The resin prepared by the preparation method disclosed by the invention can achieve ultraviolet light-heat dual curing, is good in flexibility of a curing membrane, small in curing volume shrinkage and strong in adhesive force, can achieve deep curing, and can be applied to dual-cured coating, adhesive and printing ink.
priorityDate 2012-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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