| abstract |
A kind of light reflective anisotropic conductive paste, it is as the anisotropic conductive paste used when manufacturing light-emitting device in light-emitting components such as wiring flip chip on board installation light-emitting diodes (LED), lead to the increased reflection layer of manufacturing cost in the setting not on LED, in the case of mixing light reflective insulated particle in order to improve luminous efficiency, it can inhibit the reduction of the adhesive strength of the light-emitting component and distributing board under hot environment, and it can also inhibit to be connected the reduction of reliability after TCT, the light reflective anisotropic conductive paste forms conductive particle and light reflective insulative particles disperse in hot curing resin composition.Hot curing resin composition contains epoxide and thermocatalytic type curing agent. |