| abstract |
The invention provides when semiconductor chip being joined on adherend by thermosetting die bonding film, can prevent from by packing material, the stress that this semiconductor chip applies local also being reduced to the thermosetting die bonding film of the breakage of semiconductor chip thus and possessing the dicing/die bonding film of this thermosetting die bonding film.Thermosetting die bonding film of the present invention, containing adhesive compound and the packing material comprising particulate, wherein, if the thickness of described thermosetting die bonding film is Y(μm), set the maximum particle diameter of described packing material as X(μm) time, ratio X/Y(-) be less than 1. |