http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102925066-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b1d8c2ae4d24f60d7ae2ef0af47360ea |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08 |
| filingDate | 2012-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_980711134c610853e427474d0c718599 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d39b643c75a4256f532d176fe7a8183a |
| publicationDate | 2014-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102925066-B |
| titleOfInvention | Epoxy resin adhesive film and preparation method thereof |
| abstract | The invention discloses an epoxy resin adhesive film and a preparation method thereof. In the current product, after epoxy resin is subjected to crosslinking and curing, the crosslinking density is high, the internal stress is large, the epoxy resin is crisp, and the shock resistance is poor. The adhesive film disclosed by the invention is a thin film of 50-200 microns, and the thin film comprises 30-60 percent of epoxy resin, 20-60 percent of acrylic rubber, 7.5-15 percent of curing agent and 0-10 percent of montmorillonite. The method comprises the following steps of dissolving the epoxy resin, the acrylic rubber and the curing agent into an acetone solvent, then adding the montmorillonite, and dispersing for 5-15 minutes; coating the solution onto a polytetrafluoroethylene film substrate, and controlling the thickness of the adhesive film; placing for 24-36 hours at room temperature, and volatilizing for 12-24 hours under vacuum at the room temperature; and finally obtaining the resin adhesive finished product after stripping from the substrate. The adhesive film prepared by the method has good flexibility, cohesiveness and strength, and the preparation technological process is simple. |
| priorityDate | 2012-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 39.