http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102922163-B

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_beb08e20fbd33531d47e8df5eb3ee81b
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26
filingDate 2012-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2015-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb7a73defe2dd629327c99fa874d251c
publicationDate 2015-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-102922163-B
titleOfInvention Lead-free aluminum solder wire and preparation method thereof
abstract The invention relates to a lead-free aluminum solder wire and a preparation method thereof. The lead-free aluminum solder wire comprises, by weight, 1.2-3.0% of metal components and 97-98.8% of soldering flux; the metal components comprise, by weight, 98-99.7% of tin and 0.3-2% of copper; and the soldering flux comprises, by weight, 60-85% of fluorination hydroxylamine, 5-30% of metal active salt, 1-5% of an active agent and 0.1-5% of a corrosion inhibitor. The lead-free aluminum solder wire is good in solderability, high in soldering efficiency which can be improved by over 10%, small in welding spattering and capable of lessening subsequent corrosion, reducing washing difficulties and saving precious tin solder, the soldering flux is not prone to leak and seep during storage, and problems that welding spattering is large, solderability is not high and soldering flux clamped in solder wires leak out to pollute the whole rolled products and even lead to product scrapping under serious conditions are solved.
priorityDate 2012-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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