| abstract |
A kind of system and method that forms substrate through vias is provided. Embodiment comprises: in substrate, form opening, and by the first barrier layer liner opening. Utilize conductive material filling opening, the second barrier layer is formed as contacting with conductive material. Utilize the material different from forming the second barrier layer and different formation methods to form the first barrier layer, make to adjust materials and methods, thereby the validity in device is maximized. The present invention also provides a kind of interconnection barrier structure and method. |