http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102851109-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b1c1d57207fd6f294a677860325f36a1 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C10M169-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C10M173-02 |
| filingDate | 2012-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a6f053af0daa16c49af9e00e734e065 |
| publicationDate | 2014-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102851109-B |
| titleOfInvention | Cooling liquid for diamond cutting line to cut solar silicon chips |
| abstract | The invention provides a cooling liquid for a diamond cutting line to cut solar silicon chips, which comprises the following components by mass percent: 10 to 90 percent of water, 2 to 86 percent of polyethylene glycol, 1 to 25 percent of dispersing agent, 0.1 to 20 percent of chelate, 0.5 to 15 percent of metal corrosion inhibitor and 0.1 to 2 percent of defoamer. The cooling liquid can be matched with the diamond cutting line for cutting, has good lubricating and cooling effects, effectively reduces the line breaking rate, has a good dispersant effect on silicon powder and iron tramp produced during the cutting process, guarantees the surface performance of the silicon chips, is low in cost and is pollution-free and environmentally friendly. |
| priorityDate | 2012-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 88.