| abstract |
Problem of the present invention is to provide a kind of resin combination, and the content of inorganic filling material maintains and existing resin same degree by it, and the thermal expansivity of the in-plane of resin cured matter is low, and thermotolerance, flame retardant resistance are also excellent.Solution of the present invention adopts a kind of resin combination, and it contains epoxy resin (A), maleimide compound (B), solidifying agent (C) and inorganic filler (D), and wherein, described epoxy resin (A) is the material shown in following formula (I). |