http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102823084-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29298 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-75315 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83101 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-75316 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-07811 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-75 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-641 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R43-00 |
| filingDate | 2011-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2015-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102823084-B |
| titleOfInvention | The manufacture method of light-emitting device |
| abstract | Use anisotropically conducting adhesive the light-emitting components such as light-emitting diode (LED) element to be carried out on wiring plate flip-chip to install when manufacturing light-emitting device, even if do not arrange the reflection layer causing manufacturing cost to increase in LED element, also can improve luminous efficiency, and light-emitting component can be made not produce be full of cracks or breach.Therefore, at light-emitting component with between the wiring plate that should be connected this light-emitting component, configuration is containing after the Light-reflective anisotropic conductive adhesive of hot curing resin composition, conducting particles and light reflective insulating particle, by the Shao Er A rubber hardness (JIS of light-emitting component for wiring plate compressive plane? K6253) be more than 40 and elastomer head less than 90 carries out heating pressurization, thus carry out anisotropic conductive connection. |
| priorityDate | 2010-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 99.