| abstract |
The present invention provides an electronic device whose reliability is improved by increasing the bonding strength between a glass substrate and a sealing layer when local heat sealing such as laser sealing is applied. An electronic device (1) includes a first glass substrate (2), a second glass substrate (3), and a sealing layer (8) that seals an electronic element portion provided between the glass substrates (2), (3). The sealing layer (8) is composed of a layer obtained by locally heating a sealing material including a sealing glass, a low-expansion filler, and an electromagnetic wave absorbing material with electromagnetic waves such as laser light or infrared rays, and melting and adhering them. A reaction layer (11) having a maximum depth of 30 nm or more from the interface with the sealing layer (8) is formed inside the first glass substrate (2) and the second glass substrate (3). |