http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102783255-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-382 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate | 2011-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102783255-B |
| titleOfInvention | Copper foil for printed circuit board and copper-clad laminate for printed circuit board |
| abstract | Disclosed is a copper foil for printed circuit boards which comprises a copper foil and, deposited on a surface thereof, a layer comprising nickel, zinc, and copper (hereinafter, referred to as ＂copper-nickel-zinc layer＂), characterized in that the amount of deposited zinc in the copper-nickel-zinc layer is 200-2,000 [mu]g/dm2 and that in the copper-nickel-zinc layer, the amount of Ni is 1-50 wt.%, (amount of deposited zinc (mass%))/{100-(amount of deposited copper (mass%))} is 0.3 or more, and (amount of deposited copper (mass%))/{100-(amount of deposited zinc (mass%))} is 0.3 or more. A method for treating a surface of a copper foil has been established with which it is possible to effectively prevent a circuit erosion phenomenon that occurs when a copper foil laminated to a resin base is subjected to soft etching of a circuit with a sulfuric acid/hydrogen peroxide etchant. |
| priorityDate | 2010-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.