http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102775706-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d6a6f422b091ba12ea61d4adbf1b0e8e |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L27-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-28 |
| filingDate | 2012-08-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7641fb56f443ce5ebf31c0428721bf28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_52d077ac5c4148145891ac720e67ad16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d001774424badc852a49096952b5d5d |
| publicationDate | 2014-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102775706-B |
| titleOfInvention | Cenosphere-filled polytetrafluoroethylene heat-insulation thermal-insulation material and preparation method thereof |
| abstract | The invention provides a cenosphere-filled polytetrafluoroethylene (PTFE) heat-insulation thermal-insulation material and a preparation method of the cenosphere-filled polytetrafluoroethylene (PTFE) heat-insulation thermal-insulation material. The mass percentage of the cenosphere in the heat insulation thermal insulation material is 5-40%, the thermal conductivity is not more than 0.2W/(m.K), the density is not more than 1.5g/cm<3>, the compressive strength is not less than 25MPa, and the heat insulation thermal insulation material is durable to the corrosion of sulfuric acid, sodium hydroxide and potassium permanganate solution of any concentration. The invention also provides the preparation method of the heat-insulation thermal-insulation material. The method comprises the following steps of: (1) uniformly mixing and stirring the following ingredients by mass percentage: 60-95% of polytetrafluoroethylene and 5-40% of cenosphere; (2) carrying out compression molding to the mixture obtained in the step (1) at 10MPa, and keeping the pressure for more than 1 minute; (3) sintering the molded product obtained in the step (2) and keeping the temperature for more than 20 minutes; and (4) cooling the sinter obtained in the step (3) to the room temperature so as to obtain a finished product. The heat-insulation thermal-insulation material prepared by the method is durable to low and high temperatures, durable to contamination and is nonflammable, so that the material can be used for high temperature heat insulation boards, heat conveying pipelines and various heat insulation thermal insulation materials in building engineering, and the like. |
| priorityDate | 2012-08-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.