| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d84aa8c4818bda002eded1de6d318389 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L27-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-16 |
| filingDate |
2011-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd0a61c8a44c604360e844b1c875bbba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7da600a2e217012d900ac72ebf9d1b5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_372378be7d7350f16b56b113bb3761e5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c42d94306067e9797925279e0372472a |
| publicationDate |
2014-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-102775704-B |
| titleOfInvention |
Composite dielectric material, its preparation method, plate capacitor and printed circuit board |
| abstract |
The invention relates to a polymer matrix composite dielectric material containing metal particles, and its preparation method, and also relates to a plate capacitor and a printed circuit board using the composite dielectric material. The composite dielectric material contains at least one polymer and metal copper particles which are uniformly dispersed in the polymer and have surfaces being oxidized, wherein the volume percentage of the copper particles is greater than 0, and less than or equal to 55%. The surfaces of the metal copper particles are oxidized to obtain the composite dielectric material with the high dielectric constant stably increasing with the increase of the copper particle content. |
| priorityDate |
2011-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |