http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102766317-B

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K13-02
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filingDate 2012-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2013-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_287b99bd7da4f0b6382bddb798d08ff8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d0f2792e6f955d1a0b11989978ffa88
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publicationDate 2013-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-102766317-B
titleOfInvention Organosilicone modified phenolic aldehyde injection molding material and preparation method thereof
abstract The invention discloses an organosilicone modified phenolic aldehyde injection molding material and a preparation method of the organosilicone modified phenolic aldehyde injection molding material. The phenolic aldehyde injection molding material comprises, by weight, of 40-70% of organosilicone modified thermoplastic phenolic resin, 5-30% of wood flour, 10-30% of packing material, 0.5-2% of release agent, 0.25-1.5% of coloring agent, 2.5-15% of curing agent and 0.25-5% of auxiliary curing agent. The organosilicone modified phenolic aldehyde injection molding material is prepared by mixing, smashing or pelleting the components. The phenolic aldehyde injection molding material is long in storage time, not apt to become damp, excellent in weather fastness, small in relative density and low in cost of production, and solidified materials are excellent in toughness and heat resistance. Plastic parts made of the organosilicone modified phenolic aldehyde injection molding material has the advantages of being good in toughness, small in relative density, high in volume mass resistivity and excellent in heat resistance.
priorityDate 2012-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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