| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e663a57d048402cc5ef1cd2b1d3bf7fc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31681
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1071
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1042 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 |
| filingDate |
2010-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dbcf234b25056e5a4a9edd4c686d730a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40d2e63fa80567f66c67dbc2871759d0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_66b10dc8d0fb5c600de412cd3368b7e2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ee2b6eb5e2d0a26622a929b346745dba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8eef488d8115835f5a320ff3a9a6846d |
| publicationDate |
2012-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-102753625-A |
| titleOfInvention |
Polyamic acid resin composition, preparation method thereof, and polyimide metal laminate using same |
| abstract |
The invention provides a polyamic acid resin composition, a preparation method thereof and a polyimide metal laminate using the composition. Wherein the polyamic acid resin composition includes the epoxy compound represented by the following chemical formula 1 defined in the specification. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108948354-A |
| priorityDate |
2009-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |