http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102741972-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6704 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02096 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1642 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02052 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67046 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1872 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1689 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 |
| filingDate | 2010-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102741972-B |
| titleOfInvention | The technique keeping substrate surface moistening in the process of plating |
| abstract | Method and system for the PROCESS FOR TREATMENT substrate by comprising integrated electroless deposition craft is included in the surface that processes described substrate in electroless deposition module with the conductive features disposed thereon layer of deposits fluid at described substrate.Then in described electroless deposition module, use the described surface of substrate described in rinse fluid rinsing.Described rinsing is controlled to prevent the transfer membrane making to be limited by described rinse fluid that dries on described surface to be still coated on the described surface of described substrate.Described substrate is removed from described electroless deposition module, is remained on the described surface of described substrate by described transfer membrane simultaneously.Described transfer membrane on the described surface of described substrate prevent the drying on the described surface of described substrate make described in remove be moistening.Described substrate is once be removed from described electroless deposition module, and it is just moved in rear deposition module, keeps described transfer membrane on the described surface of described substrate simultaneously. |
| priorityDate | 2009-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 28.