| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5313
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5399
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5399
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5313
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4021
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5399 |
| filingDate |
2011-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2015-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2015-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-102725323-B |
| titleOfInvention |
Flaky resin composition, use the manufacture method of the sealing method of the circuit components of this flaky resin composition, electronic devices and components, method of attachment and fixing means and composite sheet, the electronic devices and components using this composite sheet, electronics, composite sheet |
| abstract |
The present invention is a kind of flaky resin composition, its be comprise (A) liquid bisphenol type epoxy resin, (B) softening temperature is the solid-state polyfunctional epoxy resin of less than 70 DEG C and (C) hardener for epoxy resin as the flaky resin composition of required composition, wherein, the mass ratio of described (A)/(B) is 10/90 ~ 30/70. |
| priorityDate |
2010-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |