http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102675960-B

Outgoing Links

Predicate Object
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
filingDate 2011-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2015-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2015-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-102675960-B
titleOfInvention A kind of Nanometer Copper tin alloy electrically conductive ink and preparation method thereof and using method
abstract The invention belongs to material chemistry technical field, relate to a kind of electrically conductive ink, particularly a kind of Nanometer Copper alloy conductive ink and preparation method thereof and using method.The present invention adopts Nanometer Copper tin alloy to replace nanometer copper-silver alloy as the conductive filler material in electrically conductive ink, both the sintering temperature of electrically conductive ink had been reduced, compare nanometer copper-silver alloy conductive ink simultaneously, improve resistance of oxidation, the mechanical property that improve conducting wire that electrically conductive ink after sintering formed and the weldability of electrically conductive ink when sintering, and avoid the problem occurring silver ion migration.Meanwhile, in the present invention, doped with thulium in Nanometer Copper tin alloy, the crystal boundary of Nanometer Copper tin alloy is increased, electron scattering rate increases, and causes specific conductivity to compare Nanometer Copper alloy and increases.On the other hand, the price due to tin is compared silver and is wanted cheap many, also reduces the raw materials cost of electrically conductive ink of the present invention.
priorityDate 2011-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 35.