http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102675572-B
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d6a6f422b091ba12ea61d4adbf1b0e8e |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07F7-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-28 |
filingDate | 2012-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2014-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_287b99bd7da4f0b6382bddb798d08ff8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_33dcafb30f54693bfec4ea5ec039affd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d0f2792e6f955d1a0b11989978ffa88 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0228d8d413cbcb782c359f279aae002 |
publicationDate | 2014-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-102675572-B |
titleOfInvention | Application of organic silicon modifier in modified thermosetting phenolic resin |
abstract | The invention discloses application of an organic silicon modifier in modified thermosetting phenolic resin. The organic silicon modifier is easy to prepare, and a phenolic resin system modified by the organic silicon modifier is high in uniformity and stable in quality. The thermosetting phenolic resin can be prepared from phenol, formaldehyde solution and the organic silicon modifier serving as raw materials by alkali catalytic condensation. The thermosetting phenolic resin is structurally characterized in that polydimethylsiloxane chain segments are chemically bonded to phenolic resin molecules. The prepared modified phenolic resin is difficult to moisturize; the toughness and the heat resistance of the solidified material are excellent; the toughness of a material prepared when the modified phenolic resin is applied to an impregnated material is superior to that of a common phenolic resin product; and the modified phenolic resin can be used as adhesive for preparing composite materials such as high-performance friction materials, and can effectively improve the shearing strength of an adhered position and avoid degumming. |
priorityDate | 2012-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 43.