http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102660211-B

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J161-06
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filingDate 2012-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2013-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_adc0e016327b9bd6a2a539e7ac186f38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de69bebcd9e82e5c5467ccc4b78bd21f
publicationDate 2013-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-102660211-B
titleOfInvention Modified epoxy adhesive for aramid paper honeycomb
abstract The invention discloses modified epoxy adhesive for aramid paper honeycomb, and belongs to the field of production of aramid paper honeycomb. The modified epoxy adhesive comprises high-temperature-resistant resin, rubber flexibilizer and main adhesive resin, wherein the high-temperature-resistant resin is composed of phenolic resin or novolac epoxy resin and solid epoxy resin, the rubber flexibilizer is composed of rubber solid, amine firming agent and filler, and the main adhesive resin is composed of bisphenol A type liquid epoxy resin or multi-functional liquid epoxy resin. The modified epoxy adhesive is mainly used for adhering aramid paper honeycomb.
priorityDate 2012-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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