http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102648232-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J19-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-26 |
| filingDate | 2010-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_382ae1298615c7a5a08d3bffc8730890 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91c9f2b0f9a5621504dfcd60bdf53c75 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_13a1695d847c81a1ddfce96ba0f70444 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ff188447984a6b355ee8b458d0c9947e |
| publicationDate | 2015-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102648232-B |
| titleOfInvention | Copolymerized polyamide resin, method for producing same, resin composition, and molded article formed from the copolymerized polyamide resin or the resin composition |
| abstract | Disclosed is a copolymerized polyamide resin for molding, which is composed of: a diamine component that is composed of at least two components containing not less than 70% by mole of xylylenediamine that contains not less than 20% by mole of para-xylylenediamine; and a dicarboxylic acid component that contains not less than 70% by mole of a linear aliphatic dicarboxylic acid having 6-18 carbon atoms. The copolymerized polyamide resin contains granular materials, each of which has a length of not less than 50 [mu]m and contains a polyamide component that has a melting point higher than that of the copolymerized polyamide resin by 20 DEG C or more as measured by a differential scanning calorimeter, with a density of not more than 1000 pieces/g. The copolymerized polyamide resin has very uniform and stable resin properties, while exhibiting excellent mechanical characteristics, heat resistance characteristics, chemical and physical characteristics and molding characteristics. Also disclosed are: a method for efficiently producing the copolymerized polyamide resin for molding; a resin composition; and a molded article which is formed from the copolymerized polyamide resin for molding or the resin composition. |
| priorityDate | 2009-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 146.