http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102646688-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06558 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14685 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02021 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1462 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1464 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14632 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14634 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14689 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-146 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-146 |
| filingDate | 2012-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102646688-B |
| titleOfInvention | Semiconductor device and manufacture method, semiconductor wafer stacking method and electronic equipment |
| abstract | The invention discloses semiconductor device and manufacture method thereof, the laminating method of semiconductor wafer and include the electronic equipment of above-mentioned semiconductor device.The manufacture method of described semiconductor device includes: form wiring layer in the face side of the first semiconductor wafer；Described wiring layer forms embedded membrane differential to fill, and make the surface of top of the described wiring layer in the neighboring area of described first semiconductor wafer flush the most each other with the surface of the top of the described wiring layer in the inside region of described first semiconductor wafer；And make the surface above described wiring layer relative with the expectation surface of the second semiconductor wafer, and carry out stacking, thus described first semiconductor wafer is laminated to described second semiconductor wafer.In accordance with the invention it is possible to by the adhesive force on the composition surface in increase semiconductor device to prevent coming off between fragmentation, wafer, hence improve the reliability of this semiconductor device. |
| priorityDate | 2011-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 28.