http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102643543-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d84aa8c4818bda002eded1de6d318389 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2011-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36674d24f6f3ad129bced957f4d75477 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c42d94306067e9797925279e0372472a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd0a61c8a44c604360e844b1c875bbba |
| publicationDate | 2014-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102643543-B |
| titleOfInvention | Composite dielectric material, copper-clad foil prepreg manufactured and copper-clad foil laminated board by using composite dielectric material |
| abstract | The invention discloses a composite dielectric material, a prepreg manufactured and a copper-clad foil laminated board by using the composite dielectric material, wherein the composite dielectric material comprises the components by mass percent: 4-30% of bismaleimide compound, 7-30% of cyanate ester monomer, 2-20% of epoxy resin, 2-20% of allylphenol compound, 0.5-5% of catalyst and 30-80% of inorganic filler, wherein the inorganic filler is high-dielectric oxide and/ or conductive particles, and can be evenly dispersed in organic matrix by surface grafting or surface coating modification; the prepreg manufactured by the composite dielectric material can be obtained by coating the composite dielectric material on the surface of copper foil and carrying out heat treatment at 80-100 DEG C. The copper-clad foil laminated board is obtained by laminating the prepreg at the temperature of 120-200 DEG C. The copper-clad foil laminated board has the excellent characteristics of high glass transition temperature, high dielectric constant, low dielectric loss, high peel strength and the like, thus being used for manufacturing a high-temperature resistant embedded capacitor printed circuit board (PCB). |
| priorityDate | 2011-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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