http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102627927-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a9d91b9c814b621233dd1173d18cadcb |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G81-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J161-14 |
| filingDate | 2012-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_555f34abeca9c86e4826b28d639501f9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74152c2636432d258ddc65554c5fdd16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d9a65bbdac8b77945a4bff8b238d2a9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e6bb3005b3321ccbe5aa2729f9562ed http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4233fddcbb4beef91eccab9152395921 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_478e8fd6f22e053d2928ddbec824d079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_53f376ff389b57b3d6e4656573b3caff http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa0195e882f866b89d0cdd0fbe40f0de |
| publicationDate | 2013-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102627927-B |
| titleOfInvention | Medium temperature curing high temperature resistant phenolic adhesive |
| abstract | A medium temperature curing high temperature resistant phenolic adhesive relates to an adhesive. The invention solves technical problems of phenolic high curing temperature and weak temperature tolerance of adhesive. The adhesive of the present invention consists of modified phenolic resin solution, toughening agent, curing agent, heat-resistant reinforced resin and filler. The adhesive of the invention has a low curing temperature, can be cured at 100 DEG C and obtain good adhesive strength. Curing at 100 DEG C for 6 hours, the adhesive can reach shear strength of 13.5MP and still have shear strength of 2.3MPa at 1000 DEG C. The adhesive further conducts complex reaction in high temperature usage environment and generates product with better heat resistance, thereby realizing the echelon curing and echelon temperature resistance, which are difficult for other type of high temperature resistant glue to achieve. |
| priorityDate | 2012-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 176.