| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08C19-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L15-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L47-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K13-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
2005-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2017-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-102627832-B |
| titleOfInvention |
Epoxy resin composition and semiconductor device |
| abstract |
An epoxy resin composition for encapsulating a semiconductor chip containing (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition. |
| priorityDate |
2004-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |