http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102605208-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d9de52bba13e16028dffa8775e3f3f28 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C1-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C1-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C47-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C49-00 |
| filingDate | 2012-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f3ac1ff51f4e6dd88384cfc3216d57dd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de9f4a51edf795fa83bfc370c4f64134 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_00bd84144fc58a2c75c02dc1ecd2e99d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b844c053ba210ed69ac392bdf2f8f551 |
| publicationDate | 2014-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102605208-B |
| titleOfInvention | High thermal conductivity metal-based composite material with hierarchical structure, and preparation method thereof |
| abstract | The invention discloses a high thermal conductivity metal-based composite material with a hierarchical structure, and a preparation method of the high thermal conductivity metal-based composite material; the high thermal conductivity metal-based composite material and the preparation method are characterized in that a first stage composite material (composite material I) is formed by at least one nano-reinforced body and a metallic matrix, and a second stage composite material (composite material II) is formed by at least one micron-reinforced body and the composite material I, wherein the nano-reinforced body is selected from graphene, a carbon nano tube, carbon nano-fiber, a nano-graphite flake and nano-diamond, and at least has the size of 1-100nm along the one-dimensional direction; and the micron-reinforced body is selected from diamond, silicon carbide and silicon, and has the equivalent grain size of 30-600 mu m. The composite material has low and controllable coefficient of thermal expansion, high heat conductivity, thus being used as various heat management materials. |
| priorityDate | 2012-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.