http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102604454-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b1b95a0151fe6cf57f119866e3a10c11 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D4-02 |
| filingDate | 2011-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5a1406262032bad3effaea37b937ec9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0714c60a905f267f058053db58ace18c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_725df9c2f33eb04ba4c065a8e4c75a26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2f162d92c93747bf0f23691542f2941 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ab8e50a311f8380db01fd77f291536d |
| publicationDate | 2014-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102604454-B |
| titleOfInvention | Nano stamping photoresist surface modifier |
| abstract | The invention relates to a nano stamping photoresist surface modifier and belongs to the technical field of photoresist materials of a semiconductor manufacturing technology. The surface modifier comprises the following components in percentage by weight: 65-85% of organic micromolecule solvent, 10-30% of full fluorine UV (ultraviolet) curing resin, 0.5-5% of surfactant, 0.1-0.5% of photo-initiator and 0.1-0.5% of stabilizer. According to the proportion, the components are placed into a container in turn, the components are heated and uniformly stirred, the mixture is stabilized for half a hour at 30-40 DEG C, and the stabilized mixture is filtered by a filter with the aperture of 0.2Mum, so as to obtain a surface treating agent. The surface treating agent is sprayed on a stamping photoresist surface so as to be used as the surface treating agent. The surface treating agent can be used for effectively reducing the surface energy of a photoresist, so as to smoothly demould, reduce the defects and protect a template. |
| priorityDate | 2011-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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