| abstract |
The present invention relates to a water-soluble resin composition for forming a fine pattern, which is coated and heat-treated on a photoresist film formed with a contact hole pattern, thereby reducing the size of the above-mentioned contact hole, which comprises the following: The water-soluble polymer represented by the above chemical formula 1 and the first water-soluble solvent, [chemical formula 1] In the above chemical formula 1, each of R 1 , R 2 , R 3 and R 5 is C independently containing hydrogen, ether group, ester group, carbonyl group, acetyl group, epoxy group, nitrile group, amine group or aldehyde group. 1-30 alkyl or C 3-30 cycloalkyl, R 4 , R 6 , R 7 and R 8 are independently hydrogen or methyl, n is an integer from 0 to 5, and a is from 0.05 to 0.5 Real numbers, b, c, and d are real numbers of 0 to 0.7, respectively, and the above-mentioned a, b, c, and d satisfy the condition of a+b+c+d=1. |