http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102597320-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9f6be6dc36ecc0498e0e9fe880e52822 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-073 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-34 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1637 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1651 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-52 |
| filingDate | 2011-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50e29e857aee19ae100ae94a389d8dc4 |
| publicationDate | 2015-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102597320-B |
| titleOfInvention | Gold displacement plating solution, and method for formation of joint part |
| abstract | The present invention provides a gold displacement plating solution and a plating treatment technique, both of which can achieve uniform film thicknesses in the formation of a joint part that comprises a nickel layer, a palladium layer and a gold layer laminated in this order. The present invention provides a gold displacement plating solution which is used for forming, on a conductive layer comprising an electrically conductive metal, a joint part that comprises a nickel layer, a palladium layer and a gold layer laminated in this order, and which is characterized in that the gold displacement plating solution contains a gold cyanide salt, a complexing agent and a copper compound, the ratio of the complexing agent to the copper compound, i.e., the complexing agent/copper ions, in the gold displacement plating solution falls within the range from 1.0 to 500 by mole, and a compound formed from the complexing agent and the copper compound has a stability constant of 8.5 or more at pH 4-6. |
| priorityDate | 2010-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 78.