http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102573268-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49165 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-421 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-073 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0361 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0789 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2009-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecce8fbe14f1156db699665529658527 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4cdca730fb0f4a6a48c9325c89b16082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_878b5f1e91cd6564d8f97b52d78256ff |
| publicationDate | 2015-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102573268-B |
| titleOfInvention | Multilayer printed wiring board and method for manufacturing multilayer printed wiring board |
| abstract | The invention relates to a multilayer printed wiring board and a method for manufacturing the same. The multilayer printed wiring board according to the present invention comprises: a first interlayer resin insulation layer; a first conductive circuit formed on the first interlayer resin insulation layer; a second interlayer resin insulation layer formed on the first interlayer resin insulation layer and the first conductive circuit, and having an opening portion that reaches the first conductive circuit; a second conductive circuit formed on the second interlayer resin insulation layer; and a via conductor formed in the opening portion and connecting the first conductive circuit and the second conductive circuit. The multilayer printed wiring board is characterized by the following: a metal layer, containing at least one metal from among Sn, Ni, Zn, Co, Ti, Pd, Ag, Pt and Au, is formed on the surface of the first conductive circuit, a coating film made of a coupling agent is formed on the metal layer, and at least part of the bottom portion of the via conductor is directly connected to the first conductive circuit. |
| priorityDate | 2008-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 44.