| abstract |
The present invention relates to flip chip type semiconductor back surface film, dicing tape integrated semiconductor back surface film, the manufacture method of flip chip type semiconductor back surface film and semiconductor device.Problem of the present invention is that the back side of the semiconductor element that can be connected on adherend at chip upside-down mounting type arranges electromagnetic wave shielding, and can manufacture the semiconductor device with this electromagnetic wave shielding when not reducing productivity.A kind of flip chip type semiconductor back surface film, formed on the back side being connected to the semiconductor element on adherend at chip upside-down mounting type, it has adhesive layer and electromagnetic wave shielding. |