http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102549497-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0233 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0271 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0048 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate | 2010-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d22cceb2ffa1bbecddc1ce6499d8fb4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ebcd99691401e109df9023a0a551201 |
| publicationDate | 2013-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102549497-B |
| titleOfInvention | Photosensitive resin composition and method for producing photosensitive resin film |
| abstract | Disclosed is a photosensitive resin composition which is suppressed in the formation of bubbles during drying under reduced pressure and capable of providing a photosensitive resin film that has excellent film thickness uniformity after drying. Specifically disclosed is a photosensitive resin composition which is characterized by containing (a) at least one resin selected from among polyimides, polybenzoxazoles, precursors of polyimides and precursors of polybenzoxazoles, (b) a sensitizer, (c) an organic solvent that has a boiling point at atmospheric pressure of 100-130 DEG C (inclusive), and (d) an organic solvent that has a boiling point at atmospheric pressure of not less than 150 DEG C and a viscosity at 20 DEG C of more than 1.1 mPas but less than 1.5 mPas. The photosensitive resin composition is also characterized in that the content of the component (c) is 40-90% by weight (inclusive) relative to the total weight of the organic solvents and the content of the component (d) is 10-60% by weight (inclusive) relative to the total weight of the organic solvents. |
| priorityDate | 2009-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 424.