http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102544034-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06513 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06541 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14627 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1464 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14636 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14634 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1469 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-146 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04N5-374 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-552 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-146 |
| filingDate | 2011-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102544034-B |
| titleOfInvention | Solid-state imaging device and semiconductor devices and its manufacture method and electronic installation |
| abstract | The present invention relates to solid-state imaging device and semiconductor devices and their manufacture method and electronic installation.The solid-state imaging device includes：Photographing element, it includes the first semiconductor substrate, the first wiring layer formed on the surface of first semiconductor substrate and forms the first metal layer on the top of first wiring layer；And logic element, it includes the second semiconductor substrate, the second wiring layer formed on the surface of second semiconductor substrate and forms the second metal layer on the top of second wiring layer, and the logic element is laminated to the photographing element so that the first metal layer and the second metal layer are engaged with each other.The present invention can be readily formed screen layer between the element of upper and lower part, so as to reduce the influence for resulting from electromagnetic wave or crosstalk between the element of upper and lower part. |
| priorityDate | 2010-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.