http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102543784-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d9de52bba13e16028dffa8775e3f3f28 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2012-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_47e151a325a91d1b4f00762fd443d908 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d7717362a950c5c1dd0cfe4dbfd6a064 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_68d604b793b2c1ef57dd6af3757bfa3b |
| publicationDate | 2014-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102543784-B |
| titleOfInvention | Solid-state hot-compression low-temperature bonding method using nickel micro needle cones |
| abstract | The invention provides a solid-state hot-compression low-temperature bonding method using nickel micro needle cones. A layer of metallic nickel featured by being bestrewed with needle cones is manufactured on one side of a to-be-bonded welding spot, and welding flux is used on the other side of the to-be-bonded welding spot. A colligator is used for being aligned with the electrically interconnected welding spot, the welding spot is heated to a certain temperature not higher than the solder cap melting point, and a bonding pressing force is exerted and maintained for some time so that inlay bonding of needle cones and welding flux at the position of the interconnection point is achieved. A thin layer of precious metal is electroplated on the layer of nickel micro needle cones to prevent the surface from being oxidized prior to bonding. After bonding is finished, the welding spot is placed at a certain temperature for heat treatment for some time to achieve diffusion reaction and remove holes. The solid-state hot-compression low-temperature bonding method using nickel micro needle cones is capable of overcoming some defects in the prior art in novel encapsulation technology application, avoids thermal damage caused to components by reflow soldering process temperature, and resolves the problems of welding flux spreading in molten welding and solid-liquid phase fast reaction. |
| priorityDate | 2012-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 19.