http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102534740-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-48 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25C7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25C1-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-002 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-10 |
| filingDate | 2011-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102534740-B |
| titleOfInvention | The electroplating device of wafer-class encapsulation and technique |
| abstract | Subject application is the electroplating device about wafer-class encapsulation and technique.A kind of have two kinds of metals of the standard electric sedimentation potential that is different in essence (such as plating the most simultaneously, the deposition of Sn Ag alloy) equipment include: anode chamber, it is for containing anolyte and active anode, described anolyte includes first, less noble metal (such as, stannum) ion but do not include second, the ion of relatively noble metal (such as, silver)；Cathode chamber, it is for containing catholyte and substrate, and described catholyte comprises the ion of the first metal (such as, stannum), the ion of second, relatively noble metal (such as, silver)；Isolating construction, it is between described anode chamber and described cathode chamber, and wherein said isolating construction is substantially prevented from relatively noble metal and transfers to described anolyte from catholyte；And characteristic of fluid and the controller that is associated, it is coupled to described equipment and is configured to perform continuous electroplating, makes the concentration of plating bath component keep virtually constant within the use cycle extended simultaneously. |
| priorityDate | 2010-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 80.