| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
2011-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2015-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55cf417591e421ba7ff95ac652e655ee
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9fc74b5d8dbcafb9728c1b894dbae322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4fedf721c4a24d3066b3235208c3514f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a8c2a5152dd82804f8b0508725b0998 |
| publicationDate |
2015-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-102534702-B |
| titleOfInvention |
Method of electroplating uniform copper layer |
| abstract |
Electroplating methods provide substantially uniform deposits of copper on the edges and walls of through-holes of printed circuit boards. The electroplating methods provide copper deposits which have high throwing power. |
| priorityDate |
2010-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |